basket  0

 

image description

image description

Sitewide Search

Alternate Currency

Products

Featured...

Opus MCU500 Master Control Unit Silver V2.7 Used
Opus MCU500 Master Control Unit Silver V2.7 UsedOpus MCU500 Master Control Unit Black V2.7 Used & Tested...


Opus Multi-room System MCU500, VSU500,WCU500, DZM20,SRC500 4 zones+4 sub zones
Opus Multi-room System MCU500, VSU500,WCU500, DZM20,SRC500 4 zones+4 sub zonesOpus Multi-room System MCU500, VSU500,WCU500 Chrome, WCU300 ...





image description

image description

More Info

Subscribe

Keep up-to-date via e-mail!


Techie Tip of the Week

 

Bob's Tip of the Week!


The secret to good soldering

Here's the secret to soldering: rather than melting the solder with the iron, heat the object you want to solder so that it is that object that melts the solder directly when applied.

To make a good solder joint between two wires, strip back the plastic sheath from the wires and heat the exposed metal with the soldering iron. Apply solder to the heated metal wire. The solder should flow readily on to the metal wire if it is hot enough. As soon as the solder flows, remove the soldering iron from the wire and let the solder cool. This process is called tinning.

Tin the other wire so that both exposed pieces of metal wire have solder on them, and position them so that the two soldered sections are touching. Apply a little solder directly to the tip of the iron, and then touch the iron to the point where the two wires touch. Remove the iron as soon as the solder melts on the wire. When the solder cools, the two wires should be soldered together. Clean the tip of the iron using a soldering iron tip cleaner and unplug the iron. Allow the iron to cool before packing away.

The process of tinning applies to all soldering, whether it is wires or components on a circuit board. Apply the solder to the both surfaces first, then remelt the solder when the surfaces are touching. Excess solder can be removed with a solder sucker.